Molecularly engineered copolyimide film for capacitive humidity sensor

被引:4
|
作者
Kim, Il Jin [1 ,2 ]
Lee, Ji Eun [2 ]
Ko, Jae Wang [1 ,2 ]
Jung, Jiyoon [3 ]
Lee, Albert S. [3 ]
Lee, Dong Jin [1 ]
Lee, Seung Geol [2 ]
Park, Bo-In [4 ]
Yu, Seunggun [5 ]
Lee, Jin Hong [2 ]
机构
[1] KIFLT, New Funct Components Res Team, Busan 47154, South Korea
[2] Pusan Natl Univ, Dept Organ Mat Sci & Engn, Busan 46421, South Korea
[3] Korea Inst Sci & Technol, Mat Architecturing Res Ctr, Hwarangno 14 Gil 5, Seoul 02792, South Korea
[4] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Daejeon 34141, South Korea
[5] KERI, Insulat Mat Res Ctr, Chang Won 51543, South Korea
基金
新加坡国家研究基金会;
关键词
Polyimide; Capacitance; Hysteresis; Humidity sensor;
D O I
10.1016/j.matlet.2020.127565
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We present a capacitive humidity sensor with molecularly engineered polyimide (PI) sensing layer. Molecularly engineered PIs were successfully prepared by synthesizing polyamic acids (PAAs) through blending of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) with 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA), and 4,4-(hexafluoroisopropylidene) diphthalic anhydride (6-FDA) as monomer, followed by thermal imidization, respectively. The molecularly engineered PIs exhibited high thermal stability as well as controllable water uptake properties. Capacitive performances of the humidity sensor with PIs were efficiently increased via simple molecular blending. (C) 2020 Elsevier B.V. All rights reserved.
引用
收藏
页数:4
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