28 GHz compact dipole antenna array integrated in fan-out eWLB package

被引：3

作者：

Aziz, Imran ^{[1
,2
]}

Wu, Dapeng ^{[3
]}

Ojefors, Erik ^{[3
]}

Hanning, Johanna ^{[3
]}

Dancila, Dragos ^{[1
]}

机构：

[1] Uppsala Univ, Dept Elect Engn, S-75103 Uppsala, Sweden

[2] Mirpur Univ Sci & Technol MUST, Dept Elect Engn, Mirpur 10250, Ajk, Pakistan

[3] Sivers Semicond AB, S-16440 Kista, Sweden

来源：

INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES | 2022年 / 14卷 / 10期

关键词：

Antenna in package (AiP); dipole array; fan-out antenna array; TRANSCEIVER;

D O I：

10.1017/S1759078722000058

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications. The dipole antenna array is placed on one of the two re-distribution layers in the fan-out eWLB (embedded Wafer Level Ball Grid Array) package. For TX and RX, separate but identical antenna arrays are placed on each side of the die. The paper presents a novel horn-shaped heatsink which not only dissipates the heat, but also improves the radiation performance. The four-elements dipole array has the impedance bandwidth of almost 6 GHz (24-30 GHz) and shows a maximum realized gain of 9.5 dBi. Beam-steering in +/- 35 deg is achieved in the azimuth plane (H-plane) by providing different phases to the dipoles through the chip. The measurements nicely agree with the simulation results.

引用

页码：1369 / 1377

页数：9

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