28 GHz compact dipole antenna array integrated in fan-out eWLB package

被引：3

作者：

Aziz, Imran ^{[1
,2
]}

Wu, Dapeng ^{[3
]}

Ojefors, Erik ^{[3
]}

Hanning, Johanna ^{[3
]}

Dancila, Dragos ^{[1
]}

机构：

[1] Uppsala Univ, Dept Elect Engn, S-75103 Uppsala, Sweden

[2] Mirpur Univ Sci & Technol MUST, Dept Elect Engn, Mirpur 10250, Ajk, Pakistan

[3] Sivers Semicond AB, S-16440 Kista, Sweden

来源：

INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES | 2022年 / 14卷 / 10期

关键词：

Antenna in package (AiP); dipole array; fan-out antenna array; TRANSCEIVER;

D O I：

10.1017/S1759078722000058

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications. The dipole antenna array is placed on one of the two re-distribution layers in the fan-out eWLB (embedded Wafer Level Ball Grid Array) package. For TX and RX, separate but identical antenna arrays are placed on each side of the die. The paper presents a novel horn-shaped heatsink which not only dissipates the heat, but also improves the radiation performance. The four-elements dipole array has the impedance bandwidth of almost 6 GHz (24-30 GHz) and shows a maximum realized gain of 9.5 dBi. Beam-steering in +/- 35 deg is achieved in the azimuth plane (H-plane) by providing different phases to the dipoles through the chip. The measurements nicely agree with the simulation results.

引用

页码：1369 / 1377

页数：9

共 50 条

[1] Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package
Shih, Mengkai
Huang, Chih-Yi
Chen, Tsan-Hsien
Wang, Chen-Chao
Tarng, David
Hung, C. P.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (09): : 1765 - 1775
[2] Broadband Fan-out Phased Antenna Array at 28 GHz for 5G Applications
Aziz, Imran
Wu, Dapeng
Ojefors, Erik
Hanning, Johanna
Wiklund, Erik
Dancila, Dragos
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2020, : 212 - 215
[3] Broadband Fan-Out Phased Antenna Array at 28GHz for 5G Applications
Aziz, Imran
Wu, Dapeng
Ojefors, Erik
Hanning, Johanna
Wiklund, Erik
Dancila, Dragos
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2020,
[4] Broadband Fan-Out Phased Antenna Array at 28GHz for 5G Applications
Aziz, Imran
Wu, Dapeng
Ojefors, Erik
Hanning, Johanna
Wiklund, Erik
Dancila, Dragos
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2020,
[5] 28 GHz circular polarized fan-out antenna array with wide-angle beam-steering
Aziz, Imran
Hanning, Johanna
Ojefors, Erik
Wu, Dapeng
Dancila, Dragos
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, 2022, 32 (03)
[6] Integrated Module Structure of Fan-out Wafer Level Package for Terahertz Antenna
Ishibashi, Daijiro
Sasaki, Shinya
Ishizuki, Yoshikatsu
Iijima, Shinya
Nakata, Yoshihiro
Kawano, Yoichi
Suzuki, Toshihide
Tani, Motoaki
2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 1084 - 1089
[7] A Low-Profile, Scalable 28-GHz Phased Array Antenna in Fan-Out Wafer-Level Package for 5G Communication
Oshima, Naoki
Hori, Shinichi
Pang, Jian
Shirane, Atsushi
Okada, Kenichi
Kunihiro, Kazuaki
2022 ASIA-PACIFIC MICROWAVE CONFERENCE (APMC), 2022, : 359 - 361
[8] A Low-Profile, Scalable 28-GHz Phased Array Antenna in Fan-Out Wafer-Level Package for 5G Communication
Oshima, Naoki
Hori, Shinichi
Pang, Jian
Shirane, Atsushi
Okada, Kenichi
Kunihiro, Kazuaki
Asia-Pacific Microwave Conference Proceedings, APMC, 2022, 2022-November : 359 - 361
[9] Fan-Out Antenna-in-Package Integration Using Heatsink Antenna
Zhang, Xuesong
Wang, Qian
Xia, Chenhui
Zhou, Chaojie
Wang, Gang
Cai, Jian
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (08): : 1262 - 1270
[10] Co-Design of Chip-Package-Antenna in Fan-out Package for Practical 77 GHz Automotive Radar
Zhu, Chuanming
Wan, Yinglu
Duan, Zongming
Dai, Yuefei
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1169 - 1174

← 1 2 3 4 5 →