Broadband Fan-out Phased Antenna Array at 28 GHz for 5G Applications

被引：0
|
作者：
Aziz, Imran [1 ,2 ]
Wu, Dapeng [3 ]
Ojefors, Erik [3 ]
Hanning, Johanna [3 ]
Wiklund, Erik [3 ]
Dancila, Dragos [1 ]
机构：
[1] Uppsala Univ, Dept Elect Engn, Uppsala, Sweden
[2] Mirpur Univ Sci & Technol MUST, Dept Elect Engn, Mirpur, Pakistan
[3] Sivers IMA AB, Kista, Sweden
来源：
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2020年
关键词：
phased array; 28 GHz antenna array; AiP; fan-out; dipole antenna; beam-steering; eWLB;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper we present a 28 GHz antenna in package (AiP) design for 5G applications. The antenna array is placed in the fan-out region of the eWLB (enhanced Wafer Level Ball Grid Array) package. Separate antenna arrays are used for TX and RX, which are placed on one of the two re-distribution layers (RDL) inside the package. The heatsink required for the chip operation is also used as a horn antenna to improve the design performance. The 4-element dipole array has the impedance bandwidth of almost 6 GHz (24 GHz-30 GHz) and gives a maximum gain of 9.5 dBi. Beam-steering in +/- 35 deg is achieved in the azimuthal plane (H-plane) by providing different phases to the dipoles through the chip.
引用
收藏
页码：212 / 215
页数：4
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