Optical Receivers in 0.35 μm BiCMOS for Heterogeneous 3D Integration

被引：0
|
作者：
Milovancev, Dinka [1 ]
Brandl, Paul [1 ]
Vokic, Nemanja [1 ]
Goll, Bernhard [1 ]
Schneider-Hornstein, Kerstin [1 ]
Zimmermann, Horst [1 ]
机构：
[1] Vienna Univ Technol, Inst Electrodynam Microwave & Circuit Engn, Vienna, Austria
来源：
2016 IEEE 19TH INTERNATIONAL SYMPOSIUM ON DESIGN AND DIAGNOSTICS OF ELECTRONIC CIRCUITS & SYSTEMS (DDECS) | 2016年
关键词：
optical communication; hybrid 3D integration; transimpedance amplifier (TIA); SiGe BiCMOS; 10; Gbit/s;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Developing paradigm in high speed communication device is heterogeneous 3D integration of electronic components designed on standard silicon wafers - and photonics, optimized in different processes. This paper shows the advantages of 3D integration and presents the measured results of two receivers fabricated in 0.35 mu m SiGe BiCMOS technology. The first is a 10 Gbit/s regulated cascode (RGC) based receiver for optical communications and the second is a 200 Mbit/s TIA for monitoring the operating point of the photonic ring modulator.
引用
收藏
页码：35 / 39
页数：5
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