Optical Receivers in 0.35 μm BiCMOS for Heterogeneous 3D Integration

被引：0

作者：

Milovancev, Dinka ^{[1
]}

Brandl, Paul ^{[1
]}

Vokic, Nemanja ^{[1
]}

Goll, Bernhard ^{[1
]}

Schneider-Hornstein, Kerstin ^{[1
]}

Zimmermann, Horst ^{[1
]}

机构：

[1] Vienna Univ Technol, Inst Electrodynam Microwave & Circuit Engn, Vienna, Austria

来源：

2016 IEEE 19TH INTERNATIONAL SYMPOSIUM ON DESIGN AND DIAGNOSTICS OF ELECTRONIC CIRCUITS & SYSTEMS (DDECS) | 2016年

关键词：

optical communication; hybrid 3D integration; transimpedance amplifier (TIA); SiGe BiCMOS; 10; Gbit/s;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Developing paradigm in high speed communication device is heterogeneous 3D integration of electronic components designed on standard silicon wafers - and photonics, optimized in different processes. This paper shows the advantages of 3D integration and presents the measured results of two receivers fabricated in 0.35 mu m SiGe BiCMOS technology. The first is a 10 Gbit/s regulated cascode (RGC) based receiver for optical communications and the second is a 200 Mbit/s TIA for monitoring the operating point of the photonic ring modulator.

引用

页码：35 / 39

页数：5

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