Heterogeneous Integration with 3D Chiplets

被引：0
|
作者：
Kulkarni, Deepak [1 ]
机构：
[1] AMD Inc, Santa Clara, CA 95054 USA
来源：
2023 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI-TSA/VLSI-DAT | 2023年
关键词：
D O I：
10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134194
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：1
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