Control of ozonated water cleaning process for photoresist removal

被引：4
|
作者：
Lim, SW [1 ]
Chidsey, CED
机构：
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[2] Stanford Univ, Dept Chem, Stanford, CA 94305 USA
来源：
ULTRA CLEAN PROCESSING OF SILICON SURFACES 2000 | 2001年 / 76-77卷
关键词：
ozone decomposition; photoresist removal; process optimization;
D O I：
10.4028/www.scientific.net/SSP.76-77.215
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：215 / 218
页数：4
相关论文
共 50 条
  • [41] Pollution prevention in food industries through both cleaning of closed equipment with ozonated water and cleaning in place (CIP) systems
    Canut, A.
    Pascual, A.
    WATER POLLUTION IX, 2008, 111 : 615 - 625
  • [42] Control of photoresist thickness uniformity in the microlithography process
    Tay, A
    IECON'03: THE 29TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, VOLS 1 - 3, PROCEEDINGS, 2003, : 2091 - 2096
  • [43] Predicting Hydroxyl Radical Activity and Trace Contaminants Removal in Ozonated Water
    Vincent, Simon
    Kotbi, Abderrahim
    Barbeau, Benoit
    OZONE-SCIENCE & ENGINEERING, 2010, 32 (04) : 244 - 251
  • [44] Photoresist removal process by hydrogen radicals generated by W catalyst
    Takata, M.
    Ogushi, K.
    Yuba, Y.
    Akasaka, Y.
    Tomioka, K.
    Soda, E.
    Kobayashi, N.
    THIN SOLID FILMS, 2008, 516 (05) : 847 - 849
  • [45] Photoresist Removal-Cleaning Technology Using Cryogenic Micro-Solid Nitrogen Spray
    Ishimoto, Jun
    Oh, U.
    Koike, Tomoki
    Ochiai, Naoya
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2014, 3 (01) : N3046 - N3053
  • [46] Strategies for alkalinity and pH control for ozonated shrimp pond water
    Whangchai, N
    Migo, VP
    Alfafara, CG
    Young, HK
    Nomura, N
    Matsumura, M
    AQUACULTURAL ENGINEERING, 2004, 30 (1-2) : 1 - 13
  • [47] Characterization of a positive chemically amplified photoresist for process control
    Jakatdar, N
    Niu, XH
    Spanos, CJ
    Romano, A
    Bendik, J
    Kovacs, R
    Hill, S
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XII, 1998, 3332 : 586 - 593
  • [48] Removal of Organic Wax and Particles on Final Polished Wafer by Ozonated DI Water
    Yi, Jae-Hwan
    Lee, Seung-Ho
    Kim, Tae-Gon
    Lee, Gun-Ho
    Choi, Eun-Suck
    Park, Jin-Goo
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2008, 18 (06): : 307 - 312
  • [49] Real-time control of photoresist development process
    Tay, A
    Ho, WK
    Kiew, CM
    Zhou, Y
    Lee, JH
    DATA ANALYSIS AND MODELING FOR PROCESS CONTROL II, 2005, 5755 : 244 - 250
  • [50] REDUCED DEVICE DAMAGE USING AN OZONE BASED PHOTORESIST REMOVAL PROCESS
    GABRIEL, C
    MITCHENER, JC
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING VI, 1989, 1086 : 598 - 604
12345