An overview of resistive random access memory devices

被引:84
|
作者
Li YingTao [1 ,2 ]
Long ShiBing [1 ]
Liu Qi [1 ]
Lu HangBing [1 ]
Liu Su [2 ]
Liu Ming [1 ]
机构
[1] Chinese Acad Sci, Lab Nanofabricat & Novel Device Integrat, Inst Microelect, Beijing 100029, Peoples R China
[2] Lanzhou Univ, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China
来源
CHINESE SCIENCE BULLETIN | 2011年 / 56卷 / 28-29期
关键词
resistive random access memory; resistive switching; performance parameters; LOW-POWER; MECHANISMS; BIPOLAR;
D O I
10.1007/s11434-011-4671-0
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
With recent progress in material science, resistive random access memory (RRAM) devices have attracted interest for nonvolatile, low-power, nondestructive readout, and high-density memories. Relevant performance parameters of RRAM devices include operating voltage, operation speed, resistance ratio, endurance, retention time, device yield, and multilevel storage. Numerous resistive-switching mechanisms, such as conductive filament, space-charge-limited conduction, trap charging and discharging, Schottky Emission, and Pool-Frenkel emission, have been proposed to explain the resistive switching of RRAM devices. In addition to a discussion of these mechanisms, the effects of electrode materials, doped oxide materials, and different configuration devices on the resistive-switching characteristics in nonvolatile memory applications, are reviewed. Finally, suggestions for future research, as well as the challenges awaiting RRAM devices, are given.
引用
收藏
页码:3072 / 3078
页数:7
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