NOVEL 3D DIE-STACKED OPTO-ELECTRONIC TRANSCEIVER ICs THAT ALLOW FOR WAFERSCALE FABRICATION

被引：0

作者：

Duan, Pinxiang ^{[1
]}

Raz, Oded ^{[1
]}

Dorren, Harmen J. S. ^{[1
]}

机构：

[1] Eindhoven Univ Technol, COBRA Res Sch, NL-5600 MB Eindhoven, Netherlands

来源：

2013 18TH MICROOPTICS CONFERENCE (MOC) | 2013年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Optical interconnects can offer small footprint, high bandwidth density and high data rates. In this paper we demonstrate a wafer scale fabrication process of the 3D stacked transceivers which leads to very high bandwidth density as well as potential low cost. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology suggested is robust.

引用

页数：2

共 42 条

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PLOS ONE, 2018, 13 (02):
[42] A Highly Scalable Poly-Si Junctionless FETs Featuring a Novel Multi-Stacking Hybrid P/N Layer and Vertical Gate with Very High Ion/Ioff for 3D Stacked ICs
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