NOVEL 3D DIE-STACKED OPTO-ELECTRONIC TRANSCEIVER ICs THAT ALLOW FOR WAFERSCALE FABRICATION

被引：0
|
作者：
Duan, Pinxiang [1 ]
Raz, Oded [1 ]
Dorren, Harmen J. S. [1 ]
机构：
[1] Eindhoven Univ Technol, COBRA Res Sch, NL-5600 MB Eindhoven, Netherlands
来源：
2013 18TH MICROOPTICS CONFERENCE (MOC) | 2013年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Optical interconnects can offer small footprint, high bandwidth density and high data rates. In this paper we demonstrate a wafer scale fabrication process of the 3D stacked transceivers which leads to very high bandwidth density as well as potential low cost. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology suggested is robust.
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