Electrochemical recovery of copper, lead and tin from a nitrate and chloride leaching solution of scrap printed circuit boards

被引:0
|
作者
Mecucci, A [1 ]
Scott, K [1 ]
机构
[1] Univ Newcastle Upon Tyne, Dept Chem & Proc Engn, Newcastle Upon Tyne NE1 7RU, Tyne & Wear, England
关键词
D O I
暂无
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
A study for recovering copper, lead and tin from scrap printed circuit boards (PCBs) has been carried out using a combination of leaching and electrodeposition. A simple aqueous nitric acid stripping solution has demonstrated the potential for selective extraction of copper and lead along with the precipitation of tin as H2SnO3 at acid concentration above 4 mol/dm(3). The electrodeposition of copper and lead in a nitrate environment has shown the influence of pH on the efficiency of the process. Alternatives that have been considered include the simultaneous electrodeposition of copper at the cathode and lead dioxide at the anode. The recovery of tin via electrodeposition from a chloride medium, obtained after dissolving the precipitate H2SnO3 in hydrochloric acid, was then studied. The use of a flow-through porous electrode (carbon felt) has been shown to be very efficient for the electro-recovery of metal ions when the concentration of species in solution becomes of the order of 100 ppm. The large specific surface area along with the turbulence generated by the electrolyte flow through the porous electrode considerably improves the mass transport to the electrode surface leading to a greater rate of electrolysis in comparison with a two dimensional electrode. The performance of a divided flow-through reactor is reported.
引用
收藏
页码:293 / 305
页数:13
相关论文
共 50 条
  • [31] Enhancement of leaching copper by organic agents from waste printed circuit boards in a sulfuric acid solution
    He, Jingfeng
    Zhang, Mingming
    Chen, Hao
    Guo, Shulian
    Zhu, Lingtao
    Xu, Jiang
    Zhou, Kui
    CHEMOSPHERE, 2022, 307
  • [32] Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder
    Xiaofei He
    Michael H. Azarian
    Michael G. Pecht
    Journal of Electronic Materials, 2011, 40 : 1921 - 1936
  • [33] Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution
    Lee, MS
    Ahn, JG
    Ahn, JW
    HYDROMETALLURGY, 2003, 70 (1-3) : 23 - 29
  • [34] Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder
    He, Xiaofei
    Azarian, Michael H.
    Pecht, Michael G.
    JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (09) : 1921 - 1936
  • [35] Leaching of lead from solder material of waste printed circuit boards (PCBs)
    Jha, Manis Kumar
    Kumari, Archana
    Choubey, Pankaj Kumar
    Lee, Jae-chun
    Kumar, Vinay
    Jeong, Jinki
    HYDROMETALLURGY, 2012, 121 : 28 - 34
  • [36] Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition
    Hao, Juanjuan
    Wang, Xiaolu
    Wang, Yishu
    Guo, Fu
    Wu, Yufeng
    JOURNAL OF MATERIAL CYCLES AND WASTE MANAGEMENT, 2023, 25 (02) : 1108 - 1119
  • [37] Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition
    Juanjuan Hao
    Xiaolu Wang
    Yishu Wang
    Fu Guo
    Yufeng Wu
    Journal of Material Cycles and Waste Management, 2023, 25 : 1108 - 1119
  • [38] Recovery of Ag, Au, and Pt from Printed Circuit Boards by Pressure Leaching
    Martinez-Ballesteros, Guadalupe
    Valenzuela-Garcia, Jesus Leobardo
    Gomez-Alvarez, Agustin
    Encinas-Romero, Martin Antonio
    Mejia-Zamudio, Flerida Adriana
    Rosas-Durazo, Aaron de Jesus
    Valenzuela-Frisby, Roberto
    RECYCLING, 2021, 6 (04)
  • [39] RECOVERY OF COPPER AND SILVER OF PRINTED CIRCUIT BOARDS FROM OBSOLETE COMPUTERS BY ONE-STEP ACID LEACHING
    de Andrade, Lidiane Maria
    de Carvalho, Mariana Alves
    Kohler Caldas, Marcos Paulo
    Romano Espinosa, Denise Crocce
    Soares Tenorio, Jorge Alberto
    DETRITUS, 2021, 14 : 86 - 91
  • [40] Selective recovery of Copper from waste mobile phone printed circuit boards using Sulphuric acid leaching
    Hossain, Md. Sohrab
    Yahaya, Ahmad Naim Ahmad
    Yacob, Lily Suhaila
    Rahim, Mohd Zulkhairi Abdul
    Yusof, Nor Nadiah Mohamad
    Bachmann, Robert Thomas
    MATERIALS TODAY-PROCEEDINGS, 2018, 5 (10) : 21698 - 21702