Selective recovery of Copper from waste mobile phone printed circuit boards using Sulphuric acid leaching

被引：1
|
作者：
Hossain, Md. Sohrab [1 ]
Yahaya, Ahmad Naim Ahmad [1 ]
Yacob, Lily Suhaila [1 ]
Rahim, Mohd Zulkhairi Abdul [1 ]
Yusof, Nor Nadiah Mohamad [1 ]
Bachmann, Robert Thomas [1 ]
机构：
[1] Univ Kuala Lumpur, Malaysian Inst Chem & Bioengn Technol, Green Chem & Sustainable Technol Cluster, Alor Gajah 78000, Malacca, Malaysia
来源：
MATERIALS TODAY-PROCEEDINGS | 2018年 / 5卷 / 10期
关键词：
Acid leaching; Printed circuit boards; Waste mobile phones; Copper recovery; SEPARATION; EXTRACTION; CU(II); ZN(II); NI(II);
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In the present study, the leaching of Cu(II) from the waste mobile phone printed circuit board (WM-PCB) was investigated using concentrated sulphuric acid solution. Cu(II)) uptake efficiency was determined at varying pH (pH 2.0 - pH 8.0), temperatures (40 degrees C-80 degrees C) and treatment time (15 - 90 min). It was observed that the copper uptake increased with increasing temperature and acid concentration. The highest Cu(II) uptake was found to be 190 mg/g at pH 6.0 and 80 degrees C within 60 min. Results indicate that sulphuric acid has the potential to recover the heavy metals from WM-PCB. (C) 2018 Elsevier Ltd. All rights reserved.
引用
收藏
页码：21698 / 21702
页数：5
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