共 50 条
- [23] Measurement methods of pad properties for chemical mechanical polishing PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2007, VOL 3: DESIGN AND MANUFACTURING, 2008, : 517 - 522
- [24] Estimating chemical mechanical polishing pad wear with compressibility International Journal of Advanced Manufacturing Technology, 2007, 32 (7-8): : 682 - 689
- [25] The effect of pad conditioning on planarization characteristics of chemical mechanical polishing (CMP) with ceria slurry Chemical-Mechanical Planarization-Integration, Technology and Reliability, 2005, 867 : 117 - 122
- [27] Estimating chemical mechanical polishing pad wear with compressibility INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2007, 32 (7-8): : 682 - 689
- [29] Evaluation of pad life in chemical mechanical polishing process using statistical metrology MICROELECTRONIC MANUFACTURING YIELD, RELIABILITY, AND FAILURE ANALYSIS III, 1997, 3216 : 70 - 79