ISFET CMOS compatible design and encapsulation challenges

被引:0
|
作者
Sudakov-Boreysha, L [1 ]
Morgenshtein, A [1 ]
Dinnar, U [1 ]
Nemirovsky, Y [1 ]
机构
[1] Technion Israel Inst Technol, Dept Biomed Engn, Haifa, Israel
关键词
ISFET; SU8; CMOS; encapsulation; flip-chip bonding;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This work shows main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.
引用
收藏
页码:535 / 538
页数:4
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