ISFET CMOS compatible design and encapsulation challenges

被引：0

作者：

Sudakov-Boreysha, L ^{[1
]}

Morgenshtein, A ^{[1
]}

Dinnar, U ^{[1
]}

Nemirovsky, Y ^{[1
]}

机构：

[1] Technion Israel Inst Technol, Dept Biomed Engn, Haifa, Israel

来源：

ICECS 2004: 11th IEEE International Conference on Electronics, Circuits and Systems | 2004年

关键词：

ISFET; SU8; CMOS; encapsulation; flip-chip bonding;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This work shows main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.

引用

页码：535 / 538

页数：4

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