ISFET CMOS compatible design and encapsulation challenges

被引：0
|
作者：
Sudakov-Boreysha, L [1 ]
Morgenshtein, A [1 ]
Dinnar, U [1 ]
Nemirovsky, Y [1 ]
机构：
[1] Technion Israel Inst Technol, Dept Biomed Engn, Haifa, Israel
来源：
ICECS 2004: 11th IEEE International Conference on Electronics, Circuits and Systems | 2004年
关键词：
ISFET; SU8; CMOS; encapsulation; flip-chip bonding;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This work shows main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.
引用
收藏
页码：535 / 538
页数：4
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