Bipolar issues in advanced power BiCMOS technology

被引:2
|
作者
Efland, T [1 ]
Devore, J [1 ]
Hastings, A [1 ]
Pendharkar, S [1 ]
Teggatz, R [1 ]
机构
[1] Texas Instruments Inc, Mixed Signal Analog Technol Dev, Dallas, TX 75265 USA
关键词
D O I
10.1109/BIPOL.2000.886166
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Technology is driven by the evolving CMOS roadmap, and as a consequence, it is increasingly difficult to integrate good performing bipolar devices without unduly increasing process complexity. Designers want and need good NPNs for key circuits; a Table of some of these is outlined. Bipolar device needs and the difficulties of device performance vs, integration are described for typical advanced power BICMOS technology with respect to design concerns. Other bipolar issues relating to guard-ring, parasitic, and ESD concerns are also briefly discussed.
引用
收藏
页码:20 / 27
页数:8
相关论文
共 50 条
  • [31] AN ADVANCED SINGLE-LEVEL POLYSILICON SUBMICROMETER BICMOS TECHNOLOGY
    BRASSINGTON, MP
    ELDIWANY, MH
    RAZOUK, RR
    THOMAS, ME
    TUNTASOOD, PT
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (04) : 712 - 719
  • [32] Scalable bipolar model for BiCMOS and bipolar circuits
    Dai, Y
    Yuan, JS
    Phanse, AM
    Yeh, CS
    Kwang, K
    ICECS 96 - PROCEEDINGS OF THE THIRD IEEE INTERNATIONAL CONFERENCE ON ELECTRONICS, CIRCUITS, AND SYSTEMS, VOLS 1 AND 2, 1996, : 868 - 871
  • [33] Integration of SiGe heterojunction bipolar transistors in a 200 mm industrial BiCMOS technology
    deBerranger, E
    Bodnar, S
    Chantre, A
    Kirtsch, J
    Monroy, A
    Granier, A
    Laurens, M
    Regolini, JL
    Mouis, M
    THIN SOLID FILMS, 1997, 294 (1-2) : 250 - 253
  • [34] A STACKED EMITTER POLYSILICON (STEP) BIPOLAR TECHNOLOGY FOR 16 MBIT BICMOS SRAMS
    SUZUKI, H
    IMAI, K
    YAMAZAKI, T
    NAKAMURA, K
    ATSUMO, T
    IKEMOTO, A
    NEC RESEARCH & DEVELOPMENT, 1993, 34 (01): : 57 - 63
  • [35] A 239-298 GHz Power Amplifier in an Advanced 130 nm SiGe BiCMOS Technology for Communications Applications
    Bucher, Thomas
    Grzyb, Janusz
    Hillger, Philipp
    Rucker, Holger
    Heinemann, Bernd
    Pfeiffer, Ullrich R.
    ESSCIRC 2021 - IEEE 47TH EUROPEAN SOLID STATE CIRCUITS CONFERENCE (ESSCIRC), 2021, : 369 - 372
  • [36] Introduction to the 1997 IEEE Bipolar/BiCMOS Circuits and Technology Meeting special issue
    McAndrew, CC
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1998, 33 (09) : 1350 - 1351
  • [37] Introduction to the Special Section on the 2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting
    Wang, Albert
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2014, 49 (09) : 1875 - 1875
  • [38] A CRYO-BICMOS TECHNOLOGY WITH SI/SIGE HETEROJUNCTION BIPOLAR-TRANSISTORS
    IMAI, K
    YAMAZAKI, T
    TATSUMI, T
    NIINO, T
    TASHIRO, T
    NAKAMAE, M
    NEC RESEARCH & DEVELOPMENT, 1991, 32 (02): : 207 - 213
  • [39] Introduction to the Special Issue on the 2003 IEEE bipolar/BiCMOS circuits and technology meeting
    El-Gamal, M
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2004, 39 (10) : 1724 - 1726
  • [40] BiCMOS technology
    Pfleiderer, HJ
    Stiebler, M
    ELECTRICAL ENGINEERING, 1996, 79 (05): : 311 - 311