Drain-Extended FinFET With Embedded SCR (DeFinFET-SCR) for High-Voltage ESD Protection and Self-Protected Designs

被引:12
|
作者
Paul, Milova [1 ]
Kumar, B. Sampath [1 ]
Nagothu, Kranthi Karmel [1 ]
Singhal, Pulkit [1 ,2 ]
Gossner, Harald [3 ]
Shrivastava, Mayank [1 ]
机构
[1] Indian Inst Sci, Dept Elect Syst Engn, Adv Nanoelect Device & Circuit Res Grp, Bengaluru 560012, Karnataka, India
[2] Indian Inst Technol Kharagpur, Dept Elect Engn, Kharagpur 721302, W Bengal, India
[3] Intel Deutschland GmbH, D-85579 Neubiberg, Germany
关键词
Electrostatic discharges; Anodes; FinFETs; Charge carrier processes; Modulation; Stress; Drain-extended FinFET (DeFinFET); electrostatic discharge (ESD); silicon-controlled rectifier (SCR); technology computer-aided design (TCAD); DENMOS DEVICE; BEHAVIOR;
D O I
10.1109/TED.2019.2949126
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article presents device design insights and design challenges for drain-extended FinFET devices with embedded silicon-controlled rectifier (SCR) (DeFinFET-SCR), which can be used as an electrostatic discharge (ESD) protection device and a self-protected high-voltage switch/driver for system-on-chip applications. The tradeoff between maximizing ESD robustness without hindering the transistor's operation is discussed in detail. An interplay between parasitic p-n-p turn-on and space charge modulation (SCM) is revealed, which strongly influences the strength of parasitic SCR and its turn-on efficiency during ESD and DC operations. Developed physical insights show that engineering p-n-p turn-on and onset of SCM are the key to maximize ESD robustness without causing early SCR turn-on during transistor operation. Based on new findings and developed physical insights, design guidelines have been derived for ESD robust DeFinFET-SCR.
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页码:5072 / 5079
页数:8
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