Carbon nanotube via technologies for future LSI interconnects

被引：0
|
作者：
Nihei, M [1 ]
Kawabata, A [1 ]
Horibe, M [1 ]
Kondo, D [1 ]
Sato, S [1 ]
Awano, Y [1 ]
机构：
[1] Fujitsu Labs Ltd, Nanotechnol Res Ctr, Atsugi, Kanagawa 2430197, Japan
来源：
MATERIALS FOR INFORMATION TECHNOLOGY: DEVICES, INTERCONNECTS AND PACKAGING | 2005年
关键词：
D O I：
10.1007/1-84628-235-7_27
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：315 / 326
页数：12
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