Fabrication and characterization of carbon nanotube interconnects

被引：23
|
作者：
Close, Gael F. [1 ]
Wong, H. -S. Philip [1 ]
机构：
[1] Stanford Univ, Ctr Integrated Syst, Stanford, CA 94305 USA
来源：
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2 | 2007年
基金：
美国国家科学基金会;
关键词：
D O I：
10.1109/IEDM.2007.4418902
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
We have fabricated arrays of individual metallic multi-wall carbon nanotube interconnects. We have also collected about two hundred resistance measurements to compare four different contact metals: Al, Au, Ti and Pd. Au and Pd contacts gave the lowest resistance. To validate the concept of high-speed carbon nanotube (CNT) interconnect, we have extended our electrical measurements of individual multiwall carbon nanotubes (MWCNTs) into the radio-frequency regime up to 15 GHz. We also discuss the reasons why the conductivity of commercial MWCNTs is not yet competitive with copper.
引用
收藏
页码：203 / +
页数：2
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