High-Speed Interconnects: History, Evolution, and the Road Ahead

被引：10

作者：

Kumbhare, Vijay Rao ^{[1
]}

Kumar, Rahul ^{[2
]}

Majumder, Manoj Kumar ^{[1
]}

Kumar, Somesh ^{[3
]}

Paltani, Punya Prasanna ^{[1
]}

Kaushik, Brajesh Kumar ^{[4
]}

Sharma, Rohit ^{[2
]}

机构：

[1] Dr SP Mukherjee Int Inst Informat Technol, Naya Raipur 493661, India

[2] Indian Inst Technol Ropar, Rupnagar 140001, India

[3] ABV Indian Inst Informat Technol & Management, Gwalior 474010, India

[4] Indian Inst Technol, Roorkee 247667, Uttar Pradesh, India

来源：

IEEE MICROWAVE MAGAZINE | 2022年 / 23卷 / 08期

关键词：

Integrated circuit interconnection; Silicon; Electronic circuits; Substrates; Reliability engineering; Printed circuits; Performance evaluation; Layout; Integrated circuit reliability; Semiconductor devices; PERFORMANCE ANALYSIS; GRAPHENE NANORIBBON; CARBON NANOTUBES; PART II; TECHNOLOGY; BUNDLE; PROPAGATION; SILICON; IMPACT;

D O I：

10.1109/MMM.2021.3136268

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An integrated circuit (IC), or chip, is a set of electronic circuits and components placed on a tiny planar silicon (Si) semiconductor substrate. These electronics circuits and components are electrically connected to one another with the help of planar and vertical conductor elements known as interconnects. This article presents a detailed overview of the evolution of interconnects, highlighting the technological milestones that have been achieved during the past four decades. Interconnects form the backbone of signal communication among devices on a chip and between chips on a printed circuit board (PCB). The layout and design of interconnects on an IC are vital to the chip's performance, functionality, reliability, efficiency, and overall fabrication yield.

引用

页码：66 / 82

页数：17

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