High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications

被引：0
|
作者：
Murugesan, Kavin Senthil [1 ]
Chernobryvko, Mykola [2 ]
Zinal, Sherko [2 ]
Rossi, Marco [2 ]
Ndip, Ivan [2 ]
Boettcher, Mathias [2 ]
Lang, Klaus Dieter [1 ,2 ]
Wieland, Marcel [3 ]
Goetze, Christian [3 ]
Bin Halim, Saquib [3 ]
Trewhella, Jean [3 ]
机构：
[1] Tech Univ Berlin, Berlin, Germany
[2] IZM, Fraunhofer Inst Reliabil & Microintegrat, Wessling, Germany
[3] GLOBALFOUNDRIES Dresden Module One LLC & Co KG, Dresden, Germany
来源：
2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2020年
关键词：
5G; mm-Wave; mobile communication; inductors; quality factor; inductance; polyimide; packaging; FoWLP; multilayer;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a multilayered integrated inductor in Fan-out Wafer Level Packaging (FoWLP) technology is investigated. The inductor is designed on polyimide for integration into the redistribution layer of the package. Excellent correlation is obtained between simulation and measurement results. The fabricated inductor has an inductance of approximately 480 pH and a quality factor of approximately 27 at 11 GHz.
引用
收藏
页码：89 / 92
页数：4
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