Cantilever type probe card for at-speed memory test on wafer

被引：7

作者：

Iwai, H ^{[1
]}

Nakayama, A ^{[1
]}

Itoga, N ^{[1
]}

Omata, K ^{[1
]}

机构：

[1] Toshiba Co Ltd, Semicond Co, Saiwai Ku, Kawasaki, Kanagawa 2128520, Japan

来源：

23RD IEEE VLSI TEST SYMPOSIUM, PROCEEDINGS | 2005年

关键词：

probe card; at-speed; memory; on wafer; test;

D O I：

10.1109/VTS.2005.34

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper, we present a new low cost probe card, which enables high speed (500MHz) memory test on wafer. Since it is difficult to characterize memory devices on wafer at high speed with a low cost probe card, then high speed memory test is usually conducted after assembling packages, although package test requires long lead time for test. We have tested Embedded DRAM at 500MHz on wafer with the new probe card which has Cantilever needles. The results show that the probe card can be used for memory at-speed test up to 500MHz.

引用

页码：85 / 89

页数：5

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