An ESD Case Study with High-Speed Interface in Electronics Manufacturing and its Future Challenge

被引：0
|
作者：
Fung, Rita [1 ]
Wong, Richard [2 ]
Tsan, James [2 ]
Batra, Jatin [2 ]
机构：
[1] Cisco Syst Hong Kong Ltd, Great Eagle Ctr, 31 Fl,23 Harbour Rd, Wan Chai, Hong Kong, Peoples R China
[2] Cisco Syst Inc, San Jose, CA USA
来源：
2017 39TH ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM (EOS/ESD) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A networking semiconductor component with 25 Gbps high-speed interface experienced high manufacturing failure rate with CDM-like failure signature at contract manufacturer; design of experiment was performed and ESD source was located. Problem details, solution, future challenge and industry awareness are discussed in this paper.
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页数：7
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