A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

被引：21
|
作者：
Chen, Si [1 ,2 ]
Zhang, Lili [1 ,2 ]
Liu, Johan [1 ,2 ,3 ,4 ]
Gao, Yulai [5 ]
Zhai, Qijie [5 ]
机构：
[1] Shanghai Univ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China
[2] Shanghai Univ, SMIT Ctr, Sch Automat & Mech Engn, Shanghai 200072, Peoples R China
[3] Chalmers Univ Technol, SMIT Ctr, SE-41296 Gothenburg, Sweden
[4] Chalmers Univ Technol, Bionano Syst Lab, Dept Microtechnol & Nanosci, SE-41296 Gothenburg, Sweden
[5] Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China
来源：
MATERIALS TRANSACTIONS | 2010年 / 51卷 / 10期
基金：
美国国家科学基金会;
关键词：
composite solder; nanoparticles; shear strength; thermal cycling; fracture mode;
D O I：
10.2320/matertrans.MJ201002
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This work looks at the development and investigation of a reinforced composite solder with low melting point The composite solder was prepared by adding Sn 3 0Ag 0 5Cu nanoparticles Into Sn 58BI solder paste 1 he Sn 3 0Ag 0 5Cu nanoparticles were manufactured using a self developed Consumable electrode Direct Current Arc (CDCA) technique The test FR 4 Printed Circuit Board (PCB) with Cu pad and Electroless Nickel Immersion Gold (ENIG) surface finish were fabricated and fifty SR1206 chip resistors were mounted on pads of test PCB with the reinforced composite solder paste by using conventional surface mount technology The differential scanning calorimetry (DSC) was used to analyze the constituent of the composite solder Joint after reflow A scanning electron microscope (SEM) transmission electron microscope (TEM) and optical microscope (OM) were employed in order to observe the morphology of nanoparticles the microstructure of reinforced composite solder Joint the crack initiation and propagation in solder Joint and the fracture mode after shear test The thermal cycling (TC) was carried out with a temperature range of 40 degrees C and 125 C The contract resistance of the solder Joint was measured during thermal cycling and the shear test of solder Joints was performed before and after 500 thermal cycles After the shear test all fracture surfaces were inspected to identify the fracture mode of the composite solder joint The results of the experiments detailed in this work indicate that the shear strength of the composite solder increased 2 times in comparison to Sn 58B(1) Meanwhile the thermomechanical fatigue (TMF) resistance of the composite solder with 1 mass% nanoparticles was 16 times stronger than Sn 58BI and 4 times stronger than Sn 3 0Ag 0 5Cu However the tendency of forming micro cracks between nanoparticles and solder matrix and the fracture within solder was increased for solder joints with more than 3 mass% nanoparticles after thermal cycling [doi 10.2320/matertrans.MJ201002].
引用
收藏
页码：1720 / 1726
页数：7
相关论文
共 50 条
  • [41] Reliability concerns of lead-free solder use in aerospace applications
    Baylakoglu, Ilknur
    2007 3RD INTERNATIONAL CONFERENCE ON RECENT ADVANCES IN SPACE TECHNOLOGIES, VOLS 1 AND 2, 2007, : 158 - 164
  • [42] Lead-free soldering: Materials science and solder joint reliability
    Zeng, Kejun
    JOM, 2009, 61 (06) : 28 - 28
  • [43] Processing, properties, and reliability of electroplated lead-free solder bumps
    Kiumi, R
    Yoshioka, J
    Kuriyama, F
    Saito, N
    Shimoyama, M
    ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, 2002, : 909 - 914
  • [44] Reliability evaluations of chip interconnect in lead-free solder systems
    Guo, YF
    Lin, JK
    De Silva, A
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1275 - 1280
  • [45] Reliability behavior of lead-free solder joints in electronic components
    Zhang, Liang
    Han, Ji-guang
    He, Cheng-wen
    Guo, Yong-huan
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (01) : 172 - 190
  • [46] Grain refinement for improved lead-free solder joint reliability
    Sweatman, K.
    Nishimura, T.
    McDonald, S.D.
    Whitewick, M.
    Nogita, K.
    SMT Surface Mount Technology Magazine, 2014, 29 (01): : 30 - 41
  • [47] Results of comparative reliability tests on lead-free solder alloys
    Grossmann, G
    Nicoletti, G
    Solèr, U
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1232 - 1237
  • [48] Reliability behavior of lead-free solder joints in electronic components
    Liang Zhang
    Ji-guang Han
    Cheng-wen He
    Yong-huan Guo
    Journal of Materials Science: Materials in Electronics, 2013, 24 : 172 - 190
  • [49] Corrosion Reliability of Lead-Free Solder Systems Used in Electronics
    Li, Feng
    Verdingovas, Vadimas
    Dirscherl, Kai
    Medgyes, Balint
    Ambat, Rajan
    2018 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC 2018), 2018, : 67 - 71
  • [50] Reliability of lead-free solder in power module with stochastic uncertainty
    Micol, A.
    Martin, C.
    Dalverny, O.
    Mermet-Guyennet, M.
    Karama, M.
    MICROELECTRONICS RELIABILITY, 2009, 49 (06) : 631 - 641
12345