共 50 条
- [21] Ridge Gap Waveguide Layer Transition for Compact 3-D Waveguide Packaging Application IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (10): : 2136 - 2139
- [22] Compact 3-D Printed Bandpass Filters Using Folded Mixed Hemispherical Resonators IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13 (09): : 1524 - 1526
- [23] Design of a Compact 3-D Metal Printed Ka-band Waveguide Polarizer IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2019, 18 (12): : 2726 - 2730
- [25] 3-D packaging methodologies for microsystems IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (04): : 623 - 630
- [27] 3-D electronic interconnect packaging 1996 IEEE AEROSPACE APPLICATIONS CONFERENCE, PROCEEDINGS, VOL 1, 1996, : 363 - 373
- [28] A review of 3-D packaging technology IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1998, 21 (01): : 2 - 14