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- [4] 3-D electronic interconnect packaging 1996 IEEE AEROSPACE APPLICATIONS CONFERENCE, PROCEEDINGS, VOL 1, 1996, : 363 - 373
- [5] 3-D packaging methodologies for microsystems IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (04): : 623 - 630
- [6] A review of 3-D packaging technology IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1998, 21 (01): : 2 - 14
- [7] 3-D X-Ray Imaging With Nanometer Resolution for Advanced Semiconductor Packaging FA IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (05): : 745 - 749
- [8] Optical 3-D Profilometry for Measuring Semiconductor Wafer Surfaces with Extremely Variant Reflectivities APPLIED SCIENCES-BASEL, 2019, 9 (10):