共 50 条
- [33] 3-D semiconductor's: More from Moore 2008 45TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2, 2008, : 664 - 664
- [34] A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level 2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 7 - +
- [35] Meshless solution of the 3-D semiconductor Poisson equation Journal of Computational Electronics, 2006, 5 : 459 - 462
- [37] Development of 3-D Silicon Module With TSV for System in Packaging IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (01): : 3 - 9
- [39] 3-D microoptic systems integration: advances in fabrication and packaging PHOTONICS PACKAGING, INTEGRATION, AND INTERCONNECTS VII, 2007, 6478
- [40] 3-D packaging: Where all technologies come together 29TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 2004, : 64 - 67