共 50 条
- [21] Effect of wire purity on copper wire bonding 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 755 - 759
- [22] Comprehensive Modeling and Analysis of Copper Wire Bonding Process 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 600 - +
- [23] Modeling and Analysis of Transmission Performance of Bonding Wire Interconnection 2016 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION (NEMO), 2016,
- [24] Micro Wear Modeling in Copper Wire Wedge Bonding 2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2016, : 21 - 24
- [26] Experimental studies of bonding pressure on heavy aluminum wire bonding strength Yadian Yu Shengguang, 2007, 3 (366-369):
- [27] Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding 2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC, 2022, : 134 - 140
- [28] Analysis and Experimental Test of Electrical Characteristics on Bonding Wire ELECTRONICS, 2019, 8 (03):