共 50 条
- [3] INFLUENCES OF BONDING PARAMETERS ON THE TOOL WEAR FOR COPPER WIRE BONDING PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 669 - 672
- [4] Improving the cleaning process in copper wire bonding by adapting bonding parameters 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
- [6] Electrical Simulation of Gold Bonding Wire with Different Parameters 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [7] The optimization of process parameters based on the orthogonal experiments in wire bonding 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [10] Parameters Optimization of Copper Wire Bonding on Thin Small Outline Package JOURNAL OF METALS MATERIALS AND MINERALS, 2013, 23 (01): : 13 - 17