Bonding wire parameters

被引:0
|
作者
Greenelsh, Mike [1 ]
机构
[1] California Fine Wire, Grover Beach, United States
来源
Advanced Materials and Processes | 2000年 / 157卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:51 / 52
相关论文
共 50 条
  • [1] Bonding wire parameters
    Greenelsh, M
    [J]. ADVANCED MATERIALS & PROCESSES, 2000, 157 (03): : 51 - 52
  • [2] A primer on bonding wire parameters
    Greenelsh, M
    [J]. MICROWAVE JOURNAL, 1999, 42 (11) : 142 - +
  • [3] INFLUENCES OF BONDING PARAMETERS ON THE TOOL WEAR FOR COPPER WIRE BONDING
    Eichwald, Paul
    Sextro, Walter
    Althoff, Simon
    Eacock, Florian
    Schnietz, Mark
    Guth, Karsten
    Broekelmann, Michael
    [J]. PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 669 - 672
  • [4] Improving the cleaning process in copper wire bonding by adapting bonding parameters
    Althoff, Simon
    Unger, Andreas
    Sextro, Walter
    Eacock, Florian
    [J]. 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [5] Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
    Lee, Jaesik
    Mayer, Michael
    Zhou, Norman
    Persic, John
    [J]. MATERIALS TRANSACTIONS, 2008, 49 (10) : 2347 - 2353
  • [6] Electrical Simulation of Gold Bonding Wire with Different Parameters
    Wang Dejing
    Zhao Yuanfu
    Yao Quanbin
    Cao Yusheng
    Lian Binhao
    Zhang Hongshuo
    [J]. 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [7] The optimization of process parameters based on the orthogonal experiments in wire bonding
    Song, Lijie
    Bao, Shengxiang
    Hu, Yongda
    Jiang, Wei
    Li, Qiang
    [J]. 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [8] Wire bonding using insulated wire and new challenges in wire bonding
    Zhong, Z. W.
    [J]. MICROELECTRONICS INTERNATIONAL, 2008, 25 (02) : 9 - 14
  • [9] Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy
    Ding, Y
    Kim, JK
    Tong, P
    [J]. MECHANICS OF MATERIALS, 2006, 38 (1-2) : 11 - 24
  • [10] Parameters Optimization of Copper Wire Bonding on Thin Small Outline Package
    Srikamonsirisak, Sorasit
    Tantinuchawong, Ubonwan
    Satirakul, Yuparwadee
    [J]. JOURNAL OF METALS MATERIALS AND MINERALS, 2013, 23 (01): : 13 - 17