A MLGA connector for high speed and high density

A noble MLGA(Multiple Line Grid Array) connector- is introduced for the first time. The connector includes rectangular disc shaped MLGs which have a multiple of terminals, and a socket with terminals arranged in a desired array Up to now: no connector has been fully imparted with a capability to match the electrical characteristics between the boards or systems, thereby necessitating a need for the presence of additional passive components on the boards. On the other hand, the MLG incorporated in the connector introduced has passive components thereon or there within, allowing the connector to function as a decoupling capacitor and a termination resistor between the boards or systems thereby eliminating the area for passive components on boards, and shortening the length of signal lines. Another advantage of the connector introduced results from the shape of MLG, which allows the terminals to be arranged in an array, as compared to the most conventional connectors having double sided terminals, making it possible to impart the new connector with a better surface mountability on boards and a higher I/O density. For example, compared to conventional connector at 0.5mm terminal pitch, the new connector can achieve 20 % higher I/O density at 1mm terminal pitch with easier mountability, which translates into low costs in both component and assembly levels. Measurements and simulations at terminals indicate that the inductance is 1.2 nH and the RF and digital bandwidths are 13 GHz and 4 GHz, respectively When this promising electrical property at terminal is combined with noise reducing capacity with on-grid passives, the MLGA connector should be truly a strong candidate for the future high speed and high density connector market.