PERFORMANCE IN LOCATING TERMINALS ON A HIGH-DENSITY CONNECTOR.

被引：0
|
作者：
Flamm, L.E.
机构：
来源：
The Bell System technical journal | 1983年 / 62卷 / 6 pt 3期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
2
引用
收藏
页码：1723 / 1731
相关论文
共 50 条
  • [1] PERFORMANCE IN LOCATING TERMINALS ON A HIGH-DENSITY CONNECTOR
    FLAMM, LE
    BELL SYSTEM TECHNICAL JOURNAL, 1983, 62 (06): : 1723 - 1731
  • [2] USING A THIRD DIMENSION IN THE PACKAGE. . . THE DUAL-LEVEL, HIGH-DENSITY CONNECTOR.
    Ruehlemann, H.E.
    Insulation/Circuits, 1973, 19 (13): : 43 - 46
  • [3] FLEXIBLE HIGH CURRENT POWER CONNECTOR.
    Sedgwick, T.O.
    IBM technical disclosure bulletin, 1983, 26 (7 A):
  • [4] High-density packaging for mobile terminals
    Pienitnaa, SK
    Martin, NI
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (03): : 467 - 475
  • [5] CONNECTOR TECHNOLOGY FOR HIGH-DENSITY MOUNTING.
    Hirai, Yuji
    JEE. Journal of electronic engineering, 1988, 25 (254): : 37 - 39
  • [6] Locating High-density Clusters with Noisy Queries
    Cao, Chen
    Chen, Shifeng
    Zou, Changqing
    Liu, Jianzhuang
    2012 21ST INTERNATIONAL CONFERENCE ON PATTERN RECOGNITION (ICPR 2012), 2012, : 3537 - 3540
  • [7] HIGH-DENSITY BACKPLANE CONNECTOR - SUITS HIGH SIGNAL SPEEDS
    LORD, R
    AUJLA, S
    INTERCONNECTION TECHNOLOGY, 1994, 10 (01): : 8 - 11
  • [8] CONNECTOR SYSTEM TARGETS FAST HIGH-DENSITY APPLICATIONS
    SHAPIRO, S
    COMPUTER DESIGN, 1990, 29 (13): : 114 - 114
  • [9] TRENDS IN HIGH-DENSITY CONNECTOR/INTERCONNECTION TECHNOLOGY.
    Jardine, Linda J.
    1978, 18 (10): : 47 - 50
  • [10] A SUBMINIATURE PUSH-ON CONNECTOR FOR HIGH-DENSITY PACKAGING
    不详
    MICROWAVE JOURNAL, 1994, 37 (08) : 114 - 114
12345