共 50 条
- [31] Offloading Channel Allocation to Terminals in High-Density IoTs for Next Generation Networks 2018 12TH INTERNATIONAL CONFERENCE ON COMMUNICATIONS (COMM), 2018, : 265 - 270
- [32] BICMOS FOR HIGH-PERFORMANCE, HIGH-DENSITY APPLICATIONS AEU-ARCHIV FUR ELEKTRONIK UND UBERTRAGUNGSTECHNIK-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 1988, 42 (02): : 65 - 74
- [33] HIGH-FREQUENCY, LOW CROSS-TALK ZERO-INSERTION-FORCE CONNECTOR. IBM technical disclosure bulletin, 1986, 28 (11): : 5012 - 5013
- [37] High-density, high-pin-count flexible SMD connector for high-speed data bus Sasaki, Shinichi, 1694, Inst of Electronics, Inf & Commun Engineers of Japan, Tokyo, Japan (E77-C):
- [39] AT THE CONNECTOR SYMPOSIUM - IC DENSITY AND PERFORMANCE SPUR CONNECTOR ADVANCES ELECTRONIC PRODUCTS MAGAZINE, 1990, 33 (05): : 22 - 22
- [40] Alternative z-axis connector technologies for high-density 3-D packaging 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1106 - 1109