USING A THIRD DIMENSION IN THE PACKAGE. . . THE DUAL-LEVEL, HIGH-DENSITY CONNECTOR.

被引：0
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作者：
Ruehlemann, H.E.
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来源：
Insulation/Circuits | 1973年 / 19卷 / 13期
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摘要：
A new multiple-level connector is described which utilizes about 80% of its available volume for the mating contact pair and only about 20% for the unavoidable terminations and male blade contacts. Thus, contacts with good electrical and mechanical parameters could be employed, resulting in excellent performance data.
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页码：43 / 46
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