Development of a SPICE modelling strategy for power devices in GaN technology

被引:2
|
作者
Bottaro, Enrico [1 ]
Cacciato, Mario [1 ]
Raffa, Alessandra [2 ]
Rizzo, Santi Agatino [1 ]
Salerno, Nunzio [1 ]
Veneziano, Pier Paolo [2 ]
机构
[1] Univ Catania, Catania, Italy
[2] STMicroelectronics, Catania, Italy
关键词
Galium nitride (GaN); GaN HEMT; behavioural modelling; static characteristics; power device; temperature-dependent; SIC MOSFET; PARAMETERS;
D O I
10.1109/IECON48115.2021.9589710
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, a behavioral static model of GaN HEMT is proposed. Different mathematical formulas have been tested to find the best for emulating the static behaviour of a 650V GaN HEMT prototype manufactured by STMicroelectronics. In literature, almost all the proposed formulas did not satisfy the target characteristics. The study of the new mathematical formulas, proposed in this paper, starts from the analysis of the models present in the literature that are rewritten and adapted for this model. Furthermore, these new equations are temperature dependent. The simulated curves of the static characteristics have been compared with those extracted by means of laboratory measurements. The model has been developed exploiting some features of STMicroelectronics models of SiC power MOSFETs.
引用
收藏
页数:6
相关论文
共 50 条
  • [21] Analysis of SPICE Models for SiC MOSFET Power Devices
    Stefanski, Andrii
    Starzak, Lukasz
    Napieralski, Andrzej
    Lobur, Mykhaylo
    [J]. 2017 14TH INTERNATIONAL CONFERENCE: THE EXPERIENCE OF DESIGNING AND APPLICATION OF CAD SYSTEMS IN MICROELECTRONICS (CADSM), 2017, : 79 - 81
  • [22] Advanced electrothermal spice modelling of large power IGBTs
    Azar, R
    Udrea, F
    Ng, WT
    Dawson, F
    Findlay, W
    Waind, P
    Amaratunga, G
    [J]. IEE PROCEEDINGS-CIRCUITS DEVICES AND SYSTEMS, 2004, 151 (03): : 249 - 253
  • [23] A perspective on multi-channel technology for the next-generation of GaN power devices
    Nela, Luca
    Xiao, Ming
    Zhang, Yuhao
    Matioli, Elison
    [J]. APPLIED PHYSICS LETTERS, 2022, 120 (19)
  • [24] Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices
    Roccaforte, Fabrizio
    Fiorenza, Patrick
    Greco, Giuseppe
    Lo Nigro, Raffaella
    Giannazzo, Filippo
    Iucolano, Ferdinando
    Saggio, Mario
    [J]. MICROELECTRONIC ENGINEERING, 2018, 187 : 66 - 77
  • [25] GaN devices for power amplifier design
    Martin-Guerrero, Teresa M.
    Ducatteau, Damien
    Camacho-Penalosa, Carlos
    Gaquiere, Christophe
    [J]. INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES, 2009, 1 (02) : 137 - 143
  • [26] GaN power devices for automotive applications
    Kachi, Tetsu
    [J]. IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM - 2007 IEEE CSIC SYMPOSIUM, TECHNOLOGY DIGEST, 2007, : 15 - 18
  • [27] GaN Devices Power Broadband Amplifiers
    Browne, Jack
    [J]. MICROWAVES & RF, 2013, 52 (02) : S32 - S32
  • [28] GaN HEMTs on silicon for power devices
    Escoffier, R.
    Torres, A.
    Fayolle-Lecocq, M.
    Buj-Dufournet, C.
    Morvan, E.
    Charles, M.
    Poisson, M. A.
    [J]. IEEE INTERNATIONAL SOI CONFERENCE, 2012,
  • [29] GaN Power Devices for Automotive Applications
    Uesugi, T.
    Kachi, T.
    [J]. GALLIUM NITRIDE MATERIALS AND DEVICES VIII, 2013, 8625
  • [30] Current status of GaN power devices
    Kachi, Tetsu
    [J]. IEICE ELECTRONICS EXPRESS, 2013, 10 (21):