High thermally conductive underfill for flip-chip applications

被引：2
|
作者：
Suzuki, K [1 ]
Suzuki, O [1 ]
Muramatu, K [1 ]
Yuda, T [1 ]
Isobe, K [1 ]
Maruyama, H [1 ]
Fukuyama, H [1 ]
机构：
[1] NAMICS Corp, R&D Dept, Niigata 9503131, Japan
来源：
INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS | 2001年
关键词：
D O I：
10.1109/ISAOM.2001.916547
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
High thermally conductive underfill has been developed. It is filled with fine particle size aluminum nitride that will provide high thermal conductivity and good fluidity. Also, this product satisfies the basic requirements for the underfill, such as the Level 3 JEDEC preconditioning test. This paper presents work in developing an approach to underfill material for flip-chip package by using an aluminum nitride.
引用
收藏
页码：46 / 50
页数：5
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