Observation of carrier recombination in single Shockley stacking faults and at partial dislocations in 4H-SiC

被引:21
|
作者
Kato, Masashi [1 ,2 ]
Katahira, Shinya [1 ]
Ichikawa, Yoshihito [1 ]
Harada, Shunta [3 ]
Kimoto, Tsunenobu [4 ]
机构
[1] Nagoya Inst Technol, Dept Elect & Mech Engn, Nagoya, Aichi 4668555, Japan
[2] Nagoya Inst Technol, Frontier Res Inst Mat Sci, Nagoya, Aichi 4668555, Japan
[3] Nagoya Univ, Inst Mat & Syst Sustainabil, Nagoya, Aichi 4648601, Japan
[4] Kyoto Univ, Dept Elect Sci & Engn, Kyoto 6158510, Japan
关键词
PIN DIODES; N-DIODES; EXPANSION;
D O I
10.1063/1.5042561
中图分类号
O59 [应用物理学];
学科分类号
摘要
Because the expansion of single Shockley stacking faults (1SSFs) is an important problem for the viability of SiC bipolar devices, there is a need to suppress it during device operation. The expansion mechanism, however, is still unclear. Therefore, the method to suppress the expansion has never been established. An important factor for the expansion could be carrier recombination in 1SSFs because the expansion has only been observed during bipolar operation or light illumination. In this study, we characterized carrier recombination by observing the photoluminescence from 1SSFs and partial dislocations (PDs). The luminescence from 1SSFs and PDs showed a fast decay component compared with that from the band edge. This result indicates that the carrier recombination in 1SSFs and at PDs was faster than that in regions without 1SSFs in 4H-SiC. In addition, because of the slower recombination at Si-core PDs compared with that in 1SSFs and at C-core PDs, the velocity of 1SSF expansion would be limited by the carrier recombination at Si-core PDs. The temperature dependence of the decay time implies that the recombination at the Si-core PD was enhanced on increasing the temperature. Published by AIP Publishing.
引用
收藏
页数:5
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