Die cracking evaluation and improvement in ULSI plastic package

被引：0

作者：

Chou, KY ^{[1
]}

Chen, MJ ^{[1
]}

Lin, CC ^{[1
]}

Su, YS ^{[1
]}

Hou, CS ^{[1
]}

Ong, TC ^{[1
]}

机构：

[1] Taiwan Semicond Mfg Co Ltd, Technol Reliabil Phys Dept, Hsinchu, Taiwan

来源：

ICMTS 2001: PROCEEDINGS OF THE 2001 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES | 2001年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new test chip is particularly designed to evaluate the large die (12 min x 12 mm, for example) plastic assembly reliability, and is able to sensitively detect the die cracking due to the thermo-mechanical stresses when undergoing packaging and reliability testing. Die cracking failures are found in the chips with six-level Al-0.5Cu metal, and depend strongly upon the encapsulated molding compound material properties during temperature cycling (TC) and thermal shock (TS) testing. While using damascene copper (Cu) technology for top two-level metal in the same packaging, the chips show no cracking failures during the same reliability testing.

引用

页码：239 / 244

页数：6

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