Die cracking evaluation and improvement in ULSI plastic package

被引：0

作者：

Chou, KY ^{[1
]}

Chen, MJ ^{[1
]}

Lin, CC ^{[1
]}

Su, YS ^{[1
]}

Hou, CS ^{[1
]}

Ong, TC ^{[1
]}

机构：

[1] Taiwan Semicond Mfg Co Ltd, Technol Reliabil Phys Dept, Hsinchu, Taiwan

来源：

ICMTS 2001: PROCEEDINGS OF THE 2001 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES | 2001年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new test chip is particularly designed to evaluate the large die (12 min x 12 mm, for example) plastic assembly reliability, and is able to sensitively detect the die cracking due to the thermo-mechanical stresses when undergoing packaging and reliability testing. Die cracking failures are found in the chips with six-level Al-0.5Cu metal, and depend strongly upon the encapsulated molding compound material properties during temperature cycling (TC) and thermal shock (TS) testing. While using damascene copper (Cu) technology for top two-level metal in the same packaging, the chips show no cracking failures during the same reliability testing.

引用

页码：239 / 244

页数：6

共 50 条

[11] Evaluation of the resistance of individual Si die to cracking
Berriche, R
Lowry, RK
Rosenfield, MI
ISTFA '98: PROCEEDINGS OF THE 24TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 1998, : 197 - 202
[12] Adhesive die attach for power application: Performance and reliability in plastic package
Tiziani, R
Passoni, G
Santospirito, G
MICROELECTRONICS RELIABILITY, 2002, 42 (9-11) : 1611 - 1616
[13] Warpage Improvement for Die Thinning using Thermal Flattening Technique for high Die-to-Package Area Ratio on FCBGA Package
Azlan, M. Z.
Koh, Y. X.
Mohan, S. Chandra
Chor, T. H.
Loh, S. C.
2024 IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS, IPFA 2024, 2024,
[14] Adhesion integrity evaluation of plastic encapsulated semiconductor package
Kawamura, N
Hirohata, K
Kawakami, T
Sawada, K
Mino, T
Kurosu, A
Takano, E
Yoo, HY
48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1132 - 1139
[15] Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking
Barnat, Samed
Bellenger, Stephane
Fremont, Helene
Gracia, Alexandrine
Talbot, Pascal
EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, : 336 - +
[16] Strain Capacity and Cracking Resistance Improvement in Mortars by Adding Plastic Particles
Hannawi, Kinda
Prince, William
Bernard, Siham Kamali
JOURNAL OF MATERIALS IN CIVIL ENGINEERING, 2013, 25 (11) : 1602 - 1610
[17] The influence of fillet height of a low modulus die attach on the wirebondability of a plastic package
Rasiah, IJ
Leong, WS
2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 291 - 295
[18] Influence of fillet height of a low modulus die attach on the wirebondability of a plastic package
Johnson Matthey Pte Ltd, Singapore, Singapore
Proceedings of the Electronic Packaging Technology Conference, EPTC, 1998, : 291 - 295
[19] Evaluation technologies for ULSI
Koyama, H
ANALYTICAL AND DIAGNOSTIC TECHNIQUES FOR SEMICONDUCTOR MATERIALS, DEVICES, AND PROCESSES, 1999, 99 (16): : 289 - 297
[20] Failure rate prediction and prevention of die cracking in over molded plastic packages
Vijayakumar, Bhuvaneshwaran
Guo, Yifan
2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2, 2006, : 798 - +

← 1 2 3 4 5 →