A multistage in-plane micro-thermoelectric cooler

被引：0

作者：

Gross, Andrew ^{[1
]}

Huang, Baoling ^{[2
]}

Hwang, Gi-Suk ^{[2
]}

Lawrence, Chris ^{[3
]}

Ghafouri, Niloufar ^{[1
]}

Lee, Sang Woo ^{[1
]}

Kim, Hanseup ^{[1
]}

Uher, Citrad ^{[3
]}

Kaviany, Massoud ^{[2
]}

Najafi, Khalil ^{[1
]}

机构：

[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA

[2] Univ Michigan, Dept Mech Engn, Ann Arbor, MI USA

[3] Univ Michigan, Dept Phys, Ann Arbor, MI USA

来源：

MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a mutli-stage thermoelectric micro cooler designed for integration with a wide variety of MEMS devices, including MEMS resonators, which benefit from decreased phase noise at low temperatures. The cooler is fabricated using a multilayer process that allows the device to achieve thermal isolation greater than 10,000 K/W while still maintaining mechanical robustness for practical applications. Co-evaporated thin film bismuth telluride and antimony telluride are used as the thermoelectric materials. The cooler is 9X9 mm(2) and a preliminary prototype has achieved cooling of 3.8 K, comparable to values predicted using a one-dimensional mathematical model.

引用

页码：840 / +

页数：2

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