ELECTRODEPOSITED MICRO COPPER BUMPS FOR PACKAGING MODULE OF A MICRO-THERMOELECTRIC COOLER

被引：0
|
作者：
Kardak, Alay A. [1 ]
Podlaha-Murphy, Elizabeth J.
Murphy, Michael C. [1 ]
Devireddy, Ram V. [1 ]
机构：
[1] Louisiana State Univ, Dept Mech Engn, Baton Rouge, LA 70803 USA
来源：
PROCEEDINGS OF THE ASME SUMMER BIOENGINEERING CONFERENCE 2008, PTS A AND B | 2009年
关键词：
D O I：
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中图分类号：
R318 [生物医学工程];
学科分类号：
0831 ;
摘要：
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页码：367 / 368
页数：2
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