A multistage in-plane micro-thermoelectric cooler

被引:0
|
作者
Gross, Andrew [1 ]
Huang, Baoling [2 ]
Hwang, Gi-Suk [2 ]
Lawrence, Chris [3 ]
Ghafouri, Niloufar [1 ]
Lee, Sang Woo [1 ]
Kim, Hanseup [1 ]
Uher, Citrad [3 ]
Kaviany, Massoud [2 ]
Najafi, Khalil [1 ]
机构
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
[2] Univ Michigan, Dept Mech Engn, Ann Arbor, MI USA
[3] Univ Michigan, Dept Phys, Ann Arbor, MI USA
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a mutli-stage thermoelectric micro cooler designed for integration with a wide variety of MEMS devices, including MEMS resonators, which benefit from decreased phase noise at low temperatures. The cooler is fabricated using a multilayer process that allows the device to achieve thermal isolation greater than 10,000 K/W while still maintaining mechanical robustness for practical applications. Co-evaporated thin film bismuth telluride and antimony telluride are used as the thermoelectric materials. The cooler is 9X9 mm(2) and a preliminary prototype has achieved cooling of 3.8 K, comparable to values predicted using a one-dimensional mathematical model.
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页码:840 / +
页数:2
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