Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

被引：51
|
作者：
Sadeghinia, M. [1 ]
Jansen, K. M. B. [1 ]
Ernst, L. J. [1 ]
机构：
[1] Delft Univ Technol, NL-2628 CD Delft, Netherlands
来源：
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 2012年 / 32卷
关键词：
Epoxy/epoxides; Viscoelastisity; Cure/hardening; Mechanical properties; MECHANICAL-PROPERTIES; AMORPHOUS POLYMERS; TEMPERATURE; ADHESIVE; SHRINKAGE;
D O I：
10.1016/j.ijadhadh.2011.10.007
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
Semi-conductor devices are mostly encapsulated by epoxy molding compound (EMC) materials. During encapsulation stresses are generated due to the curing of the molding compound. Moreover, additional stresses will build up during cooling down from molding to ambient temperature caused by the differences in the coefficient of thermal expansion. These residual stresses add up to the stresses generated during mechanical loading and may lead to product failure. The viscoelastic properties of the encapsulation material depend highly on temperature and degree of cure. In this paper the thermo-mechanical properties of an epoxy molding compound with and without filler are investigated both experimentally and theoretically. The cure dependent properties of the EMCs, likewise, the cure kinetics, coefficient of thermal expansion and cure shrinkage were measured using a Differential Scanning Calorimetry (DSC) and a GNOMIX high pressure dilatometer. In addition using a Dynamic Mechanical Analyzer (DMA) the time and temperature dependent storage modulus was measured and mastercurves were constructed. (C) 2011 Elsevier Ltd. All rights reserved.
引用
下载
收藏
页码：82 / 88
页数：7
相关论文
共 50 条
  • [31] Toward a constitutive model for cure-dependent modulus of a high temperature epoxy during the cure
    Zarrelli, M.
    Skordos, A. A.
    Partridge, I. K.
    EUROPEAN POLYMER JOURNAL, 2010, 46 (08) : 1705 - 1712
  • [32] CURE KINETICS OF AN EPOXY-NOVOLAC MOLDING COMPOUND
    HSIEH, TH
    SU, AC
    JOURNAL OF APPLIED POLYMER SCIENCE, 1990, 41 (5-6) : 1271 - 1280
  • [33] CURE BEHAVIOR OF AN EPOXY-NOVOLAC MOLDING COMPOUND
    SU, AC
    HSIEH, TH
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1990, 200 : 114 - PMSE
  • [34] CURE BEHAVIOR OF AN EPOXY-NOVOLAC MOLDING COMPOUND
    HSIEH, TH
    SU, AC
    JOURNAL OF APPLIED POLYMER SCIENCE, 1992, 44 (01) : 165 - 172
  • [35] Synthesis and characterization of thermosetting furan-based epoxy materials with improved thermo-mechanical properties
    Hu, Fengshuo
    La Scala, John J.
    Sadler, Joshua M.
    Palmese, Giuseppe R.
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2013, 246
  • [36] Thermo-mechanical characterization of epoxy/clay nanocomposites as matrices for carbon/nanoclay/epoxy laminates
    Dorigato, Andrea
    Pegoretti, Alessandro
    Quaresimin, Marino
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (19-20): : 6324 - 6333
  • [37] Atomistic modeling of thermo-mechanical properties of cubic SiC
    Szpunar, Barbara
    Malakkal, Linu
    Rahman, Jahidur
    Szpunar, Jerzy A.
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2018, 101 (10) : 4753 - 4762
  • [38] Atomistic modeling of thermo-mechanical properties of cubic SiC
    Szpunar, Barbara (B.Szpunar@usask.ca), 1600, Blackwell Publishing Inc. (101):
  • [39] Fully cure-dependent modeling and characterization of EMC's with application to package warpage simulation
    Ernst, L. J.
    Jansen, K. M. B.
    Saraswat, M.
    van't Hof, C.
    Zhang, G. Q.
    Yang, D. G.
    Bressers, H. J. L.
    ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 123 - +
  • [40] Moisture-dependent thermo-mechanical constitutive modeling of wood
    Fleischhauer, Robert
    Hartig, Jens U.
    Haller, Peer
    Kaliske, Michael
    ENGINEERING COMPUTATIONS, 2019, 36 (01) : 2 - 24
12345