CURE BEHAVIOR OF AN EPOXY-NOVOLAC MOLDING COMPOUND

被引:29
|
作者
HSIEH, TH [1 ]
SU, AC [1 ]
机构
[1] NATL SUN YAT SEN UNIV,INST MAT SCI & ENGN,KAOHSIUNG 80424,TAIWAN
关键词
D O I
10.1002/app.1992.070440118
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The isothermal cure of an epoxy-novolac molding compound was studied by means of differential scanning calorimetry (DSC). The glass transition temperature (T(g)) of the molding compound increased in an approximately linear manner with conversion (alpha) during the major part of the cure process. Predictions of an empirical kinetic scheme (established earlier from dynamic DSC results) compared favorably with the present isothermal results in the absence of vitrification. In combination with the gel point conversion (alpha(gel)) determined via dynamic rheological analysis and gravimetric measurements, our DSC results indicated that gelation bears no apparent effect on the rate of cure whereas vitrification retards the cure reaction. Based on the measured alpha(gel), the approximate T(g)-alpha-relationship, and the thermokinetic results, the time-temperature-transformation diagram of this molding compound was constructed and discussed.
引用
收藏
页码:165 / 172
页数:8
相关论文
共 50 条
  • [1] CURE BEHAVIOR OF AN EPOXY-NOVOLAC MOLDING COMPOUND
    SU, AC
    HSIEH, TH
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1990, 200 : 114 - PMSE
  • [2] CURE KINETICS OF AN EPOXY-NOVOLAC MOLDING COMPOUND
    HSIEH, TH
    SU, AC
    JOURNAL OF APPLIED POLYMER SCIENCE, 1990, 41 (5-6) : 1271 - 1280
  • [3] Variation in dielectric properties of an epoxy-novolac molding compound during dynamic cure
    Hsieh, TH
    Ho, KS
    POLYMER ENGINEERING AND SCIENCE, 1999, 39 (07): : 1335 - 1343
  • [4] Cure monitoring via different techniques: isothermal cure of an epoxy-novolac molding compound
    Hsieh, T.H.
    Su, A.C.
    Journal of Polymer Research, 1994, 1 (03) : 313 - 320
  • [5] Chemorheological analysis of an epoxy-novolac molding compound
    Hsieh, TH
    Wang, TL
    Ho, KS
    Wang, YZ
    POLYMER ENGINEERING AND SCIENCE, 2000, 40 (02): : 418 - 429
  • [6] A study on the cure behavior of epoxy molding compound
    Yun, SY
    Oh, M
    Park, NJ
    POLYMER-KOREA, 2000, 24 (06) : 837 - 844
  • [7] Dynamic cure kinetics of epoxy-novolac compounds as studied by differential scanning calorimetry
    Yang, Shin-Shiao
    Hsieh, Tar-Hwa
    Bi, Hsiaotao T.
    Ho, Ko-Shan
    Ho, Tsung-Han
    Chen, Ho-Ruei
    Ye, Shi-Hao
    Chang, Yu-Chen
    Journal of Applied Polymer Science, 2009, 114 (04): : 2373 - 2377
  • [8] FORMULATION + CURE CYCLE STUDY FOR ANHYDRIDE-CURED EPOXY-NOVOLAC SYSTEM
    MACK, AC
    INDUSTRIAL & ENGINEERING CHEMISTRY PRODUCT RESEARCH AND DEVELOPMENT, 1964, 3 (03): : 213 - &
  • [9] Study on epoxy-novolac modified by bismaleimide
    Zhao, Li-Mei
    Xia, Hua
    Gong, Rong-Zhou
    Gongneng Cailiao/Journal of Functional Materials, 2007, 38 (03): : 404 - 407
  • [10] Dynamic Cure Kinetics of Epoxy-Novolac Compounds as Studied by Differential Scanning Calorimetry
    Yang, Shin-Shiao
    Hsieh, Tar-Hwa
    Bi, Hsiaotao T.
    Ho, Ko-Shan
    Ho, Tsung-Han
    Chen, Ho-Ruei
    Ye, Shi-Hao
    Chang, Yu-Chen
    JOURNAL OF APPLIED POLYMER SCIENCE, 2009, 114 (04) : 2373 - 2377