System design for 3D multi-FPGA packaging

被引：0
|
作者：
Thorolfsson, Thorlindur [1 ]
Franzon, Paul D. [1 ]
机构：
[1] North Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2007年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
3D stacking and integration can provide tremendous advantages to electronic systems. This paper explores the system-level considerations such as layout, routing and IO in the design of 3D Multi-FPGA Packaging, along with their architectural implications.
引用
收藏
页码：171 / +
页数：2
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