Thin-Film Microtensile-Test Structures for High-Throughput Characterization of Mechanical Properties

被引：15

作者：

Oellers, T. ^{[2
]}

Angela, V. G. ^{[1
]}

Kirchlechner, C. ^{[1
]}

Dehm, G. ^{[1
]}

Ludwig, A. ^{[2
]}

机构：

[1] Max Planck Inst Eisenforsch GmbH, Max Planck Str 1, D-40237 Dusseldorf, Germany

[2] Ruhr Univ Bochum, Inst Mat, D-44801 Bochum, Germany

来源：

ACS COMBINATORIAL SCIENCE | 2020年 / 22卷 / 03期

基金：

欧洲研究理事会;

关键词：

thin film; micromechanical testing; combinatorial materials science; physical vapor deposition; high-throughput experimentation; TENSILE PROPERTIES; CU; NANOCRYSTALLINE; ELECTROMIGRATION; STRENGTH; PLASTICITY; DUCTILITY; HARDNESS; FAILURE; STRESS;

D O I：

10.1021/acscombsci.9b00182

中图分类号：

O69 [应用化学];

学科分类号：

081704 ;

摘要：

A photolithographic process for the rapid fabrication of thin-film tensile-test structures is presented. The process is applicable to various physical vapor deposition techniques and can be used for the combinatorial fabrication of thin-film tensile-test structure materials libraries for the high-throughput characterization of mechanical properties. The functionality of the fabrication process and the feasibility of performing high-quality measurements with these structures are demonstrated with Cu tensile-test structures. In addition, the scalability from unary structures to libraries with compositional variations is demonstrated.

引用

页码：142 / 149

页数：8

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