Thin-Film Microtensile-Test Structures for High-Throughput Characterization of Mechanical Properties

被引：15
|
作者：
Oellers, T. [2 ]
Angela, V. G. [1 ]
Kirchlechner, C. [1 ]
Dehm, G. [1 ]
Ludwig, A. [2 ]
机构：
[1] Max Planck Inst Eisenforsch GmbH, Max Planck Str 1, D-40237 Dusseldorf, Germany
[2] Ruhr Univ Bochum, Inst Mat, D-44801 Bochum, Germany
来源：
ACS COMBINATORIAL SCIENCE | 2020年 / 22卷 / 03期
基金：
欧洲研究理事会;
关键词：
thin film; micromechanical testing; combinatorial materials science; physical vapor deposition; high-throughput experimentation; TENSILE PROPERTIES; CU; NANOCRYSTALLINE; ELECTROMIGRATION; STRENGTH; PLASTICITY; DUCTILITY; HARDNESS; FAILURE; STRESS;
D O I：
10.1021/acscombsci.9b00182
中图分类号：
O69 [应用化学];
学科分类号：
081704 ;
摘要：
A photolithographic process for the rapid fabrication of thin-film tensile-test structures is presented. The process is applicable to various physical vapor deposition techniques and can be used for the combinatorial fabrication of thin-film tensile-test structure materials libraries for the high-throughput characterization of mechanical properties. The functionality of the fabrication process and the feasibility of performing high-quality measurements with these structures are demonstrated with Cu tensile-test structures. In addition, the scalability from unary structures to libraries with compositional variations is demonstrated.
引用
收藏
页码：142 / 149
页数：8
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