Heat Dissipation Improvement with Diamond Heat Spreader on Hybrid Si Micro-Cooler for GaN Devices

被引：0

作者：

Han, Yong ^{[1
]}

Lau, Boon Long ^{[1
]}

Tang, Gongyue ^{[1
]}

Zhang, Xiaowu ^{[1
]}

机构：

[1] ASTAR, Inst Microelect, 11 Sci Pk Rd,Singapore Sci Pk 2, Singapore 117685, Singapore

来源：

PROCEEDINGS OF THE 2015 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC) | 2015年

关键词：

Microelectronic cooling; GaN device; Diamond heat spreader; Micro-jet array impingement;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A diamond heat spreader of small size has been directly attached between the chip and the hybrid Si micro-cooler for thermal performance improvement of the GaN-on-Si device. In the fabricated test vehicle, one hotspot of size 450x300 mu m(2) is used to mimic the heating area of one GaN unit. The microwave CVD diamond of high thermal conductivity was bonded through TCB process. With the diamond heat spreader attached on the micro-channel/micro-jet cooler, to dissipated hotspot heat flux 5kW/cm(2) and 6.5kW/cm(2), the maximum chip temperature can be reduced by 25.7% and 26.1%, respectively. Two types of diamond heat spreader of different thermal conductivities are tested and compared. High improvement of heat dissipation capability has been demonstrated.

引用

页码：603 / 606

页数：4

共 50 条

[21] Near-junction microfluidic cooling for GaN HEMT with capped diamond heat spreader
Zhang, Hang
Guo, Zhixiong
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2022, 186
[22] Near-junction microfluidic cooling for GaN HEMT with capped diamond heat spreader
Zhang, Hang
Guo, Zhixiong
International Journal of Heat and Mass Transfer, 2022, 186
[23] Heat dissipation technology of GaN power Amplifier based on diamond carrier
Ji, Naiyi
Zhou, Hongda
Zhang, Lixiang
Zhao, Yongzhi
Li, Zhiqiang
Liu, Xixi
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
[24] Diamond single crystal-polycrystalline hybrid microchannel heat sink strategy for directional heat dissipation of hot spots in power devices
Hao, Xiaobin
Liu, Benjian
Li, Yicun
Zhao, Jiwen
Zhang, Sen
Wen, Dongyue
Liu, Kang
Dai, Bing
Han, Jiecai
Zhu, Jiaqi
DIAMOND AND RELATED MATERIALS, 2023, 135
[25] Heat generation and dissipation in GaN-based light emitting devices
Figge, S
Böttcher, T
Hommel, D
Zellweger, C
Ilegems, M
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 2003, 200 (01): : 83 - 86
[26] Analysis of Heat Dissipation of Nanocrystalline Diamond Capping Layers for GaN HEMTs Applications
Guo, Huaixin
Li, Yizhuang
Kong, Yuechan
Chen, Tangsheng
2021 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2021, : 187 - 189
[27] Three-dimensional analysis of a thermal dissipation system with a rectangular diamond heat spreader on a semi-infinite copper heat sink
Hui, P.
Tan, H.S.
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1996, 35 (9 A): : 4852 - 4861
[28] Nonlinear thermal analysis of a rectangular diamond IIa heat spreader used for microwave power devices
Hui, P
Tan, HS
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, : 524 - 529
[29] Development of Diamond Device-Level Heat Spreader for the Advancement of GaN HEMT Power and RF Electronics
Lu, Mei-Chien
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2023, 23 (04) : 468 - 485
[30] The effect of porous material on the improvement of the micro-chip heat dissipation
Huang, Chyouhwu B.
Chen, Hung-Shyong
Wu, Szu-Ming
PROCEEDINGS OF THE MICRO/NANOSCALE HEAT TRANSFER INTERNATIONAL CONFERENCE 2008, PTS A AND B, 2008, : 1097 - 1104

← 1 2 3 4 5 →