Evaluation of novel lactone derivatives for chemically amplified EUV resists

被引:1
|
作者
Tanaka, Hiroyasu [1 ]
Mizusaka, Tetsuhiko [1 ]
Tanagi, Hiroyuki [1 ]
Furukawa, Kikuo [1 ]
Yamamoto, Hiroki [2 ]
Kozawa, Takahiro [2 ]
机构
[1] Mitsubishi Gas Chem Co Inc, Katsushika, Tokyo 1258601, Japan
[2] Osaka Univ, Inst Sci & Ind Res, Ibaraki, Osaka 5670047, Japan
关键词
lactone; EUV; sensitivity; proton affinity; electron beam; ACID GENERATION EFFICIENCY; ELECTRON-BEAM; X-RAY; IMMERSION; DEPENDENCE; PROTON;
D O I
10.1117/12.2083755
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
EUV lithography is the most favorable process for high volume manufacturing of semiconductor devices beyond 1X nm half-pitch at present. Many efforts have revealed effective proton sources in acid generation in EUV resists, and the effective proton generation and the control of the generated acid diffusion are required to improve the breakthrough of the resolution - line width roughness - sensitivity(RLS) trade-off. To clarify the lithographic performance of these derivatives, we synthesized the acrylic ter/tetrapolymers containing novel lactone derivatives - LCHO and LAATB - as model photopolymers and exposed the resist samples based on these polymers to EUV and EB radiation. On the basis of the lithographic performances of these photoresists, we evaluated the characteristics of lactone derivatives upon exposure to EUV radiation. We discuss the relationship between the chemical structures of these derivatives and lithographic performance.
引用
收藏
页数:12
相关论文
共 50 条
  • [41] Exposure Simulation Model for Chemically Amplified Resists
    Sang-Kon Kim
    Optical Review, 2003, 10 : 335 - 338
  • [42] Chemically amplified X-ray resists
    Taylor, JW
    Babcock, C
    Sullivan, M
    IRRADIATION OF POLYMERIC MATERIALS: PROCESSES, MECHANISMS, AND APPLICATIONS, 1993, 527 : 224 - 244
  • [43] Line edge roughness of chemically amplified resists
    Azuma, T
    Chiba, K
    Imabeppu, M
    Kawamura, D
    Onishi, Y
    ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVII, PTS 1 AND 2, 2000, 3999 : 264 - 269
  • [44] Chemically amplified resists: Past, present, and future
    Ito, H
    MICROLITHOGRAPHY 1999: ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVI, PTS 1 AND 2, 1999, 3678 : 2 - 12
  • [45] Modification of Chemically Amplified Resists by Radical Copolymerization
    Bulgakova, S.
    Johns, M.
    Kiseleva, E.
    MODERN TRENDS IN POLYMER SCIENCE-EPF 09, 2010, 296 : 127 - 132
  • [46] Component segregation in model chemically amplified resists
    Woodward, John T.
    Fedynyshyn, Theodore H.
    Astolfi, David K.
    Cann, Susan
    Roberts, Jeanette M.
    Leeson, Michael J.
    ADVANCES IN RESIST MATERIALS AND PROCESSING TECHNOLOGY XXIV, 2007, 6519
  • [47] Photoacid diffusion in chemically amplified DUV resists
    Itani, T
    Yoshino, H
    Hashimoto, S
    Yamana, M
    Samoto, N
    Kasama, K
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1997, 214 : 240 - PMSE
  • [48] Enhanced Catalyst Mobility in Chemically Amplified Resists
    Bottoms, Christopher M.
    Terlier, Tanguy
    Stein, Gila E.
    Doxastakis, Manolis
    ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXIX, 2022, 12055
  • [49] CHEMICALLY AMPLIFIED RESISTS - EFFECT OF POLYMER STRUCTURE
    THOMPSON, LF
    REICHMANIS, E
    HOULIHAN, FM
    TARASCON, RG
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1989, 197 : 31 - PMSE
  • [50] NEW DIRECTIONS IN THE DESIGN OF CHEMICALLY AMPLIFIED RESISTS
    REICHMANIS, E
    GALVIN, ME
    UHRICH, KE
    MIRAU, P
    HEFFNER, SA
    POLYMERIC MATERIALS FOR MICROELECTRONIC APPLICATIONS: SCIENCE AND TECHNOLOGY, 1994, 579 : 52 - 69